TechnologyEnglish • 7 months ago

TSMC unveils 1.6nm process technology with backside power delivery, rivals Intel's competing design

www.tomshardware.com

2

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TSMC unveils 1.6nm process technology with backside power delivery, rivals Intel's competing design

www.tomshardware.com

TechnologyEnglish • 7 months ago

2

TSMC goes angstrom-class nodes.

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@Entropywins
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6•7 months ago
ASMLs new EUV lithography is coming out to play.
fmstrat
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fedilink
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5•7 months ago
This is how battery tech should be unveiled. Specs. Comparable specs.

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