NEO Semiconductor develops 3D DRAM with AI processing — new tech eyes to replace current HBM tech to solve data bus bottlenecks

www.tomshardware.com

NEO Semiconductor develops 3D DRAM with AI processing — new tech eyes to replace current HBM tech to solve data bus bottlenecks

www.tomshardware.com

Alphane MoonM to

Hardware • 3 months ago

Will the 3D X-AI chip reduce the massive power consumption of current data centers?

You must log in or register to comment.

Chat

Hardware

[email protected]

Create a post

You are not logged in. However you can subscribe from another Fediverse account, for example Lemmy or Mastodon. To do this, paste the following into the search field of your instance: [email protected]

All things related to technology hardware, with a focus on computing hardware.

Rules (Click to Expand):

Follow the Lemmy.world Rules - https://mastodon.world/about
Be kind. No bullying, harassment, racism, sexism etc. against other users.
No Spam, illegal content, or NSFW content.
Please stay on topic, adjacent topics (e.g. software) are fine if they are strongly relevant to technology hardware. Another example would be business news for hardware-focused companies.
Please try and post original sources when possible (as opposed to summaries).
If posting an archived version of the article, please include a URL link to the original article in the body of the post.

Some other hardware communities across Lemmy:

Augmented Reality - [email protected]
Gaming Laptops - [email protected]
Laptops - [email protected]
Linux Hardware - [email protected]
Mechanical Keyboards - [email protected]
Microcontrollers - [email protected]
Monitors - [email protected]
Retro Computing - [email protected]
Single Board Computers - [email protected]
Virtual Reality - [email protected]

Icon by “icon lauk” under CC BY 3.0

109 users / day
634 users / week
1.64K users / month
3.87K users / 6 months
637 subscribers
1.64K Posts
2.05K Comments
Modlog