TSMC to Provide 3DIC Integration for AI Chips in 2027, Featuring 12 HBM4 and Chiplets Manufactured with A16 | TrendForce Insights

www.trendforce.com

TSMC to Provide 3DIC Integration for AI Chips in 2027, Featuring 12 HBM4 and Chiplets Manufactured with A16 | TrendForce Insights

www.trendforce.com

Alphane MoonM to

HardwareEnglish • 2 months ago

[News] TSMC to Provide 3DIC Integration for AI Chips in 2027, Featuring 12 HBM4 and Chiplets Manufactured with A16 | TrendForce Insights

www.trendforce.com

Jun He, Vice President of Advanced Packaging Technology and Service at TSMC, stated that 3D IC is a crucial method for integrating AI chip memory with...

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