Beijing plans 12-inch wafer fab, pouring US$4.6 billion into new chip project

www.scmp.com

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Beijing plans 12-inch wafer fab, pouring US$4.6 billion into new chip project

www.scmp.com

Alphane MoonM to

Hardware • 2 months ago

cross-posted to:
[email protected]

Beijing Yandong Microelectronics will take a controlling position with a 25 per cent stake, while other investors include display maker BOE Technology.

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