- cross-posted to:
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- cross-posted to:
- [email protected]
@[email protected]OPEnglish3•7 months ago- Samsung is reportedly working on a new cooling solution for future Exynos smartphone processors.
- This packaging tech is apparently derived from PCs and servers and sees a type of heatsink attached to the top of the processor.
- Work on the tech could be completed by Q4 2024, suggesting the Exynos 2500 could potentially use it.