Alphane MoonM to HardwareEnglish • 2 months agoQualcomm Reportedly Places Advanced Packaging Orders With UMC, Challenging TSMC's "CoWoS" Dominancewccftech.comexternal-linkmessage-square2arrow-up16arrow-down10
arrow-up16arrow-down1external-linkQualcomm Reportedly Places Advanced Packaging Orders With UMC, Challenging TSMC's "CoWoS" Dominancewccftech.comAlphane MoonM to HardwareEnglish • 2 months agomessage-square2
minus-squareAlphane MoonOPMlinkEnglish2•2 months agoI wonder how much of this was driven by actual lack of capacity for TSMC’s “CoWoS” packaging verses the merits of UMC’s packaging process.
minus-square@vzqlink2•2 months agoAlmost all of it. But still, not being dependent on as single supplier is a win regardless.
I wonder how much of this was driven by actual lack of capacity for TSMC’s “CoWoS” packaging verses the merits of UMC’s packaging process.
Almost all of it. But still, not being dependent on as single supplier is a win regardless.