Alphane MoonM to HardwareEnglish • 15 hours agoQualcomm Reportedly Places Advanced Packaging Orders With UMC, Challenging TSMC's "CoWoS" Dominancewccftech.comexternal-linkmessage-square2arrow-up16arrow-down10
arrow-up16arrow-down1external-linkQualcomm Reportedly Places Advanced Packaging Orders With UMC, Challenging TSMC's "CoWoS" Dominancewccftech.comAlphane MoonM to HardwareEnglish • 15 hours agomessage-square2
minus-squareAlphane MoonOPMlinkEnglish2•15 hours agoI wonder how much of this was driven by actual lack of capacity for TSMC’s “CoWoS” packaging verses the merits of UMC’s packaging process.
minus-square@vzqlink2•15 hours agoAlmost all of it. But still, not being dependent on as single supplier is a win regardless.
I wonder how much of this was driven by actual lack of capacity for TSMC’s “CoWoS” packaging verses the merits of UMC’s packaging process.
Almost all of it. But still, not being dependent on as single supplier is a win regardless.