Rekall IncorporatedM to HardwareEnglish • 2 months agoAMD to Build Zen 6 CCD on TSMC 3nm Process, Next-Gen cIOD and sIOD on 4nmwww.techpowerup.comexternal-linkmessage-square4fedilinkarrow-up122arrow-down11
arrow-up121arrow-down1external-linkAMD to Build Zen 6 CCD on TSMC 3nm Process, Next-Gen cIOD and sIOD on 4nmwww.techpowerup.comRekall IncorporatedM to HardwareEnglish • 2 months agomessage-square4fedilink
minus-square@HorreClink2•2 months agoI thought one of the major reasons for getting into chiplets was yields and that the I/O die didnt benefit from scaling it down any more?
minus-square@[email protected]linkfedilink2•2 months agoI don’t think it’s that it doesn’t benefit, but its benefits have little effect on performance. On Zen 4 the io die adds a constant 30W to the power usage (which is a huge portion of the total TDP) so maybe they want want to reclaim some of that
I thought one of the major reasons for getting into chiplets was yields and that the I/O die didnt benefit from scaling it down any more?
I don’t think it’s that it doesn’t benefit, but its benefits have little effect on performance. On Zen 4 the io die adds a constant 30W to the power usage (which is a huge portion of the total TDP) so maybe they want want to reclaim some of that