BrikoXM to [email protected]English • 6 days agoASE developing square packaging substrate tech to replace round waferswww.tomshardware.comexternal-linkmessage-square3fedilinkarrow-up111arrow-down10file-text
arrow-up111arrow-down1external-linkASE developing square packaging substrate tech to replace round waferswww.tomshardware.comBrikoXM to [email protected]English • 6 days agomessage-square3fedilinkfile-text
minus-square@[email protected]linkfedilinkEnglish1•edit-26 days agoJust hear me out: hexagon shaped chips. They fully tessellate and will cover an entire hexagon or approximately cover a circular wafer.
Just hear me out: hexagon shaped chips.
They fully tessellate and will cover an entire hexagon or approximately cover a circular wafer.