At the recent IEDM conference, TSMC unveiled a product roadmap for its semiconductors and next-generation production nodes that culminates in eventually delivering multiple 3D-stacked collections of chiplet...
Exactly my thought. The article seems like a good general overview of emerging trends, though. This is the first I’ve heard of backside power delivery.
The fuck kind of headline is this?? Every chipmaker is “working towards” this omnipresent goal of smaller, faster, cheaper. No shit sherlock
Exactly my thought. The article seems like a good general overview of emerging trends, though. This is the first I’ve heard of backside power delivery.