Seriously, what sadist saw a flat PCB surface, flat pick and place machine heads, and said “lets create a round component”?
Joking aside I am genuinely curious what advantage the MELF design actually offers. I know they’re a pain to get a machine to place properly, they have more solder flow issues than components with flat leads, and they seem like they would be harder to manufacture too. So why a round component? Anyone here have any insight on why they even exist?
I’m thinking about the products I’ve seen them on now and it’s always the more ruggedized boards but not the ones that are so ruggedized that they get potted or placed in hermitically sealed housings. Maybe if it’s potted or sealed well enough you don’t need the added environmental resistance and stability offered by a MELF.
I’ve never actually worked on anything that went into space to my knowledge but I imagine most electronics going into space you would want to be potted or sealed inside something just so the electronics have something to disapate heat into. That’s about the only situation I can imagine where potting would actually improve thermal characteristics. If that is the case then they would probably not use MELFs for the same reason the sealed electronics I work on probably don’t. Of course I’m still guessing on all of this though.
Fair points. Conformable coats are common in space applications.