Qualcomm has reportedly placed "advanced packaging" orders at UMC, taking the first step towards challenging TSMC's dominance.
  • Alphane MoonOPMEnglish
    2•13 hours ago

    I wonder how much of this was driven by actual lack of capacity for TSMC’s “CoWoS” packaging verses the merits of UMC’s packaging process.

    • @vzq
      2•12 hours ago

      Almost all of it. But still, not being dependent on as single supplier is a win regardless.