There is also writing on the heat spreader that serves no performance purpose.

Wtf is that title.

This doesn’t mean that it has no purpose, but it isn’t involved a bit in the operation. […] Since the SRAM and CCD layers are pretty thin, they are pretty fragile and could result in damage during manufacturing or handling. With the added dummy silicon, the issue is eliminated.

Suppose this alleviates the IHS height/thickness in some way for GNR-X. Expected it would eventually play out like this though it’s sad that RPL / HPT DT had to suffer.