Initial attempts at biodegradable electronics failed to match even basic requirements. Plant-based materials warped under heat. Bio-plastics couldn’t achieve the necessary electrical properties. Natural fibers proved too rough and irregular for precise circuit patterns. Each alternative solved one challenge while falling short on others, leading many to conclude that environmental sustainability would require compromising performance.
A research team at Johannes Kepler University in Linz, Austria, has now disproven this assumption by transforming fungal tissue into circuit boards that match conventional materials in performance while decomposing completely after use. Their approach targets the fundamental properties of the material rather than trying to replicate traditional manufacturing processes.
The findings are published in Advanced Materials (“Advanced Mycelium Skins for Sustainable Electronics”).
To protect the material during use, the researchers applied a coating of shellac - a natural resin secreted by lac bugs. This coating serves three crucial functions: it prevents moisture absorption that would disrupt electrical signals, provides an adhesive layer for copper circuit components, and enables end-of-life recycling. When submerged in ethanol, the shellac dissolves, allowing recovery of valuable metals while the fungal material composts naturally.
I’m glad they put some thought into that. It would suck for your electronics to all die if it got too humid.
Some day we will finally realize the dream of playing Among Us on fungus.
Amungus
Best joke I’ve seen all week.
This is one of the coolest things that I’ve seen done with mushrooms.
I got broken link :(
Just fixed it, thx.