• @TheGrandNagus
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    41 year ago

    For years. 2017 if you argue the separate CCXs in Zen1 Threadripper to be chiplets.

    2019 with Zen2 if you’re not counting that.

    AMD is pretty ahead of everyone when it comes to packaging tech.

    • SharkAttak
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      fedilink
      31 year ago

      Next thing they’ll declare to be the first to use 3D packaging in their CPUs.