A sprawling industrial complex being built by Huawei near Shanghai will be used to research and develop chipmaking equipment to help the tech giant overcome restrictions imposed on it by the US, local sources are reportedly saying.
The site is expected to conduct research into technology for sectors such as wireless networks and smartphones, and according to Nikkei Asia will also be the location for its plan to develop and build lithography machines for manufacturing cutting-edge chips.
The Nikkei report also claims that Huawei has successfully hired numerous engineers that have been working with leading global suppliers of chipmaking equipment, such as Applied Materials, Lam Research, KLA, and Netherlands-based ASML, which is currently the only provider of the most advanced extreme ultraviolet (EUV) photolithography kit.
It was recently reported that Huawei and a chipmaking partner have filed patents for a low-tech method called self-aligned quadruple patterning (SAQP) that could allow them to make advanced semiconductors without the need for state-of-the-art lithography equipment.
Reports surfaced last year that Huawei was creating a covert network of semiconductor plants across China, taking possession of two existing chip factories and building three others, allegedly under the names of other companies to hide its involvement.
This led the Biden administration to consider further measures against a number of Chinese semiconductor companies linked with Huawei, said to include chipmakers Qingdao Si’En, SwaySure, and Shenzhen Pensun Technology Co.
The original article contains 512 words, the summary contains 231 words. Saved 55%. I’m a bot and I’m open source!
This is the best summary I could come up with:
A sprawling industrial complex being built by Huawei near Shanghai will be used to research and develop chipmaking equipment to help the tech giant overcome restrictions imposed on it by the US, local sources are reportedly saying.
The site is expected to conduct research into technology for sectors such as wireless networks and smartphones, and according to Nikkei Asia will also be the location for its plan to develop and build lithography machines for manufacturing cutting-edge chips.
The Nikkei report also claims that Huawei has successfully hired numerous engineers that have been working with leading global suppliers of chipmaking equipment, such as Applied Materials, Lam Research, KLA, and Netherlands-based ASML, which is currently the only provider of the most advanced extreme ultraviolet (EUV) photolithography kit.
It was recently reported that Huawei and a chipmaking partner have filed patents for a low-tech method called self-aligned quadruple patterning (SAQP) that could allow them to make advanced semiconductors without the need for state-of-the-art lithography equipment.
Reports surfaced last year that Huawei was creating a covert network of semiconductor plants across China, taking possession of two existing chip factories and building three others, allegedly under the names of other companies to hide its involvement.
This led the Biden administration to consider further measures against a number of Chinese semiconductor companies linked with Huawei, said to include chipmakers Qingdao Si’En, SwaySure, and Shenzhen Pensun Technology Co.
The original article contains 512 words, the summary contains 231 words. Saved 55%. I’m a bot and I’m open source!